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2pcs 0.45mm 0.5mm 0.6mm 0.76mm 25K Lead BGA ball Tin Lead Solder Balls for BGA IC Reballing Rework

2pcs 0.45mm 0.5mm 0.6mm 0.76mm 25K Lead BGA ball Tin Lead Solder Balls for BGA IC Reballing Rework

(In stock)

2pcs 0.45mm 0.5mm 0.6mm 0.76mm 25K Lead BGA ball Tin Lead Solder Balls for BGA IC Reballing Rework

Quick Overview

informato: 0.45mm 0.5mm 0.6mm 0.76mm


quantità: 25000 pz

Product Name Price Qty

2pcs 0.45mm 0.5mm 0.6mm 0.76mm 25K Lead BGA ball Tin Lead Solder Balls for BGA IC Reballing Rework

2pcs-0.76mm
$7.30

2pcs 0.45mm 0.5mm 0.6mm 0.76mm 25K Lead BGA ball Tin Lead Solder Balls for BGA IC Reballing Rework

2pcs-0.45mm
$7.30

2pcs 0.45mm 0.5mm 0.6mm 0.76mm 25K Lead BGA ball Tin Lead Solder Balls for BGA IC Reballing Rework

2pcs-0.5mm
$7.30

2pcs 0.45mm 0.5mm 0.6mm 0.76mm 25K Lead BGA ball Tin Lead Solder Balls for BGA IC Reballing Rework

2pcs-0.6mm
$7.30

Availability: In stock

Details

informato: 0.45mm 0.5mm 0.6mm 0.76mm

quantità: 25000 pz

uso: BGA stazione di rilavorazione per bga stencil, e ' essere utilizzato per la produzione di tutti i tipi di chip!


Balls Lega: Sn 63/Pb 37----SGS Testato e Certificato
QTY: 25 K pcs/bottiglia
condizione: Nuovo
ROHS disponibili; SGS Certificato!

pacchetto: 

2 bottiglie x 25k pc saldare palle

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